Choose a clean and uniform finish with our polishing pads

The Microtex 535 polishing pad is intended for pre-polishing with diamond compounds and general polishing with aluminum oxide, cerium oxide or colloidal silica. The pad is manufactured from non-woven polyester fibers bound in a resin and the structure is firm and dense with an excellent uniformity. This composition ensures a very high level of flatness and surface roughness.

The PolyU-CE is a polyurethane based polishing pad filled with fine cerium oxide to ensure high stock removal, excellent flatness and enhanced surface finish.
The PolyU-CE pad is intended for polishing with cerium-based slurries on a wide range of materials.

The Hacosilk XB polishing pad for final polishing is a very thin satin-weaved artificial acetate-silk pad with an internal barrier film. Hacosilk XB is intended to transmit the flatness of the polishing weel and thus ensure very flat surfaces with a high finish level.

The Chemopads F/NC polishing pad is manufactured from a buffed polyurethane with microscopic voids, laminated onto a nonwoven substrate. The open-porous structure provides the possibility of using the Chemopad F/NC for semiconductor final wafer polishing under high, average, and low pressure, which reduces the need for pad change and increases productivity.